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As ball grid array component pitch continues to decrease, the need to characterize solder voidinghas become more significant. Solder void manifestation (type and/or sizes) has been used todetermine process capability as a means of quality assurance during process transfer, and asindicators of process stability from in-line manufacturing monitors. This document describeshow to characterize voids in solder spheres in ball grid array packages prior to surface-mount(SMT) reflow soldering.
Product Details
- Published:
- 10/01/2016
- Number of Pages:
- 46
- File Size:
- 1 file , 1.7 MB
