JEDEC JEP172A

JEDEC JEP172A

Click here to purchase
Over the last several decades the so called “machine model” (aka MM) and its application to the required ESD component qualification has been grossly misunderstood. The scope of this JEDEC document is to present evidence to discontinue use of this particular model stress test without incurring any reduction in the IC component’s ESD reliability for manufacturing. In this regard, the document’s purpose is to provide the necessary technical arguments for strongly recommending no further use of this model for IC qualification. The published document should be used as a reference to propagate this message throughout the industry.

Product Details

Published:
07/01/2015
Number of Pages:
22
File Size:
1 file , 240 KB

You may also like

JEDEC JEB 5-A (R1984)

JEDEC JEB 5-A (R1984)

METHODS OF MEASUREMENT FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITSstandard by JEDEC Solid State Technology Association, 01/01/1970

JEDEC JEP114.01

JEDEC JEP114.01

GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATIONstandard by JEDEC Solid State Technology Association, 10/01/2007

JEDEC JEP128

JEDEC JEP128

GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTINGstandard by JEDEC Solid State Technology Association, 11/01/1996

JEDEC JEP122H

JEDEC JEP122H

Failure Mechanisms and Models for Semiconductor Devicesstandard by JEDEC Solid State Technology Association, 09/01/2016

Back to Top