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This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.
Low Power Double Data Rate (LPDDR) 5/5Xstandard by JEDEC Solid State Technology Association, 06/01/2023
2021 International Mechanical Code and CommentaryInterpretation / Commentary by International Code Council, 09/01/2021
Standard on the Design and Construction of Log Structuresstandard by International Code Council, 09/14/2021
