JEDEC J-STD-609B

JEDEC J-STD-609B

Click here to purchase
This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This standard describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This standard also applies to 2nd level terminal materials for bumped die that are used for direct board attach.

Product Details

Published:
04/01/2016
Number of Pages:
24
File Size:
1 file , 920 KB

You may also like

JEDEC JEB 5-A (R1984)

JEDEC JEB 5-A (R1984)

METHODS OF MEASUREMENT FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITSstandard by JEDEC Solid State Technology Association, 01/01/1970

JEDEC JEP114.01

JEDEC JEP114.01

GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATIONstandard by JEDEC Solid State Technology Association, 10/01/2007

JEDEC JEP128

JEDEC JEP128

GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTINGstandard by JEDEC Solid State Technology Association, 11/01/1996

JEDEC JEP122H

JEDEC JEP122H

Failure Mechanisms and Models for Semiconductor Devicesstandard by JEDEC Solid State Technology Association, 09/01/2016

Back to Top