INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - NATURAL CONVECTION (STILL AIR)standard by JEDEC Solid State Technology Association, 01/01/2007

DEFINITION OF EXTERNAL CLEARANCE AND CREEPAGE DISTANCES OF DISCRETE SEMICONDUCTOR PACKAGES FOR THYRISTORS AND RECTIFIER DIODESstandard by JEDEC Solid State Technology Association,

INFORMATION REQUIREMENTS FOR THE QUALIFICATION OF SILICON DEVICESstandard by JEDEC Solid State Technology Association, 11/01/2017

POD135 - 1.35 V PSEUDO OPEN DRAIN I/Ostandard by JEDEC Solid State Technology Association, 03/01/2018

Thermal Test Chip Guideline (Wire Bond Type Chip)standard by JEDEC Solid State Technology Association, 06/01/2019

EMBEDDED MULTIMEDIACARD (e*MMC) e*MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, INCLUDING RELIABLE WRITE, BOOT, AND SLEEP MODES (MMCA, 4.3)standard by JEDEC Solid State Technology

ESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing - Human Body Modal (HBM) - Component Levelstandard by JEDEC Solid State Technology Association,

STANDARD FOR DESCRIPTION OF 2.5 V CMOS LOGIC DEVICESstandard by JEDEC Solid State Technology Association, 11/01/1999

BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16-BIT LOGIC FUNCTIONSstandard by JEDEC Solid State Technology Association, 07/01/2001

Component Quality Problem Analysis and Corrective Action Requirements (Including Administrative Quality Problems)standard by JEDEC Solid State Technology Association, 07/01/2018

BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16, 18, AND 20-BIT LOGIC FUNCTIONS USING A 54 BALL PACKAGEstandard by JEDEC Solid State Technology

Embedded Multi-media card (e*MMC), Electrical Standard 5.0standard by JEDEC Solid State Technology Association, 09/01/2013