DISCONTINUING USE OF THE MACHINE MODEL FOR DEVICE ESD QUALIFICATIONstandard by JEDEC Solid State Technology Association, 07/01/2014

BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGESstandard by JEDEC Solid State Technology Association, 06/01/2002

INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - JUNCTION-TO-BOARDstandard by JEDEC Solid State Technology Association, 10/01/1999

ZENER AND VOLTAGE REGULATOR DIODE RATING VERIFICATION AND CHARACTERIZATION TESTINGstandard by JEDEC Solid State Technology Association, 12/01/2009

GDDR5 SGRAMstandard by JEDEC Solid State Technology Association, 09/01/2009

DDR4 DATA BUFFER DEFINITION (DDR4DB01)standard by JEDEC Solid State Technology Association,

FBDIMM: ADVANCED MEMORY BUFFER (AMB)standard by JEDEC Solid State Technology Association, 03/01/2009

MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHESstandard by JEDEC Solid State Technology Association, 07/01/2008

3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactionsstandard by JEDEC Solid State Technology Association, 11/01/2009

DOUBLE DATA RATE (DDR) SDRAM SPECIFICATIONstandard by JEDEC Solid State Technology Association, 02/01/2008

ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TESTstandard by JEDEC Solid State Technology Association, 03/01/2009

DEFINITION OF THE SSTUB32868 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONSstandard by JEDEC Solid State Technology Association, 05/01/2007