FLIP CHIP TENSILE PULLstandard by JEDEC Solid State Technology Association, 01/01/2009

DDR2 SPD INTERPRETATION OF TEMPERATURE RANGE AND (SELF-) REFRESH OPERATIONstandard by JEDEC Solid State Technology Association, 06/01/2006

Addendum No. 1 to JESD251, Optional x4 Quad I/O With Data StrobeAmendment by JEDEC Solid State Technology Association, 10/01/2018

TERMS, DEFINITIONS AND UNITS GLOSSARY FOR LED THERMAL TESTINGstandard by JEDEC Solid State Technology Association, 05/01/2012

Addendum No. 1 to JESD209-4 - Low Power Double Data Rate 4 (LPDDR4)Amendment by JEDEC Solid State Technology Association, 01/01/2017

SERIAL FLASH DISCOVERABLE PARAMETERS (SFDP)standard by JEDEC Solid State Technology Association, 07/01/2013

FBDIMM SPECIFICATION: HIGH SPEED DIFFERENTIAL PTP LINK AT 1.5 Vstandard by JEDEC Solid State Technology Association, 03/01/2008

THE MEASUREMENT OF TRANSISTOR NOISE FIGURE AT FREQUENCIES UP TO 20 kHz BY SINUSOIDAL SIGNAL-GENERATOR METHODstandard by JEDEC Solid State Technology Association,

ADDENDUM No. 1 to JESD35 - GENERAL GUIDELINES FOR DESIGNING TEST STRUCTURES FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICSstandard by JEDEC Solid

COMPONENT QUALITY PROBLEM ANALYSIS AND CORRECTIVE ACTION REQUIREMENTS (INCLUDING ADMINISTRATIVE QUALITY PROBLEMS)standard by JEDEC Solid State Technology Association, 12/01/1999

ADDENDUM No. 4 to JESD12 - METHOD OF SPECIFICATION OF PERFORMANCE PARAMETERS FOR CMOS SEMICUSTOM INTEGRATED CIRCUITSAmendment by JEDEC Solid State Technology

EMBEDDED MULTIMEDIACARD (e*MMC) PRODUCT STANDARD, STANDARD CAPACITYstandard by JEDEC Solid State Technology Association, 07/01/2007