JEDEC JESD217

JEDEC JESD217

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGESstandard by JEDEC Solid State Technology Association, 09/01/2010

JEDEC JESD202

JEDEC JESD202

METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESSstandard by JEDEC Solid State Technology Association, 03/01/2006

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