FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICESstandard by JEDEC Solid State Technology Association, 03/01/2009

STANDARD FOR THE MEASUREMENT OF CREstandard by JEDEC Solid State Technology Association, 11/01/1967

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICESstandard by JEDEC Solid State Technology Association, 04/01/2008

POD125 - 1.25 V Pseudo Open Drain I/Ostandard by JEDEC Solid State Technology Association, 06/01/2019

DESCRIPTION OF 5 V BUS SWITCH WITH TTL-COMPATIBLE CONTROL INPUTSstandard by JEDEC Solid State Technology Association, 06/01/1999

BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTSstandard by JEDEC Solid State Technology

TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENTstandard by JEDEC Solid State Technology Association, 06/01/2001

REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICESstandard by JEDEC Solid State Technology Association, 01/01/2012

HSUL_12 LPDDR2 and LPDDR3 I/O with Optional ODTstandard by JEDEC Solid State Technology Association, 04/01/2014

ELECTROSTATIC DISCHARGE SENSITIVITY TESTING, HUMAN BODY MODEL (HBM) - COMPONENT LEVELstandard by JEDEC Solid State Technology Association, 04/01/2010

RELIABILITY QUALIFICATION OF SEMICONDUCTOR DEVICES BASED ON PHYSICS OF FAILURE RISK AND OPPORTUNITY ASSESSMENTstandard by JEDEC Solid State Technology Association, 01/01/2014

ADDENDUM No. 6 to JESD12 - INTERFACE STANDARD FOR SEMICUSTOM INTEGRATED CIRCUITSAmendment by JEDEC Solid State Technology Association, 03/01/1991