JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTSstandard by JEDEC Solid State Technology Association, 05/01/1999

STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITSstandard by JEDEC Solid State Technology Association, 04/01/2010

Universal Flash Storage Host Controller Interface (UFSHCI)standard by JEDEC Solid State Technology Association, 01/01/2018

STANDARD SPECIFICATION FOR DESCRIPTION OF B SERIES CMOS DEVICESstandard by JEDEC Solid State Technology Association, 05/01/1980

INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)standard by JEDEC Solid State Technology Association, 12/01/1995

RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATIONstandard by JEDEC Solid State Technology Association, 03/01/2012

CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SEMICONDUCTOR SUPPLIERSstandard by JEDEC Solid State Technology Association, 12/01/2011

NUMBERING OF LIKE-NAMED TERMINAL FUNCTIONS IN SEMICONDUCTOR DEVICES AND DESIGNATION OF UNITS IN MULTIPLE-UNIT SEMICONDUCTOR DEVICESstandard by JEDEC Solid State Technology Association,

MEASUREMENT OF SMALL SIGNAL HF, VHF, AND UHF POWER GAIN OF TRANSISTORSstandard by JEDEC Solid State Technology Association, 05/01/1965

TEST PROCEDURES FOR VERIFICATION OF MAXIMUM RATINGS OF POWER TRANSISTORSstandard by JEDEC Solid State Technology Association, 12/01/1967

COPLANARITY TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICESstandard by JEDEC Solid State Technology Association, 09/01/2010

ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHEDstandard by JEDEC Solid State Technology Association, 08/01/2008