IEC 63003 Ed. 1.0 en:2015
Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505¿¿¿standard by International Electrotechnical
Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505¿¿¿standard by International Electrotechnical
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive
Book by International Electrotechnical Commission, 01/10/2008
Field device integration (FDI) - Part 1: Overviewstandard by International Electrotechnical Commission, 05/12/2015
Expression of performance of fluorometric oxygen analyzers in liquid mediastandard by International Electrotechnical Commission, 06/27/2013
Terminology for voltage-sourced converters (VSC) for high-voltage direct current (HVDC) systems CONSOLIDATED EDITIONstandard by International Electrotechnical Commission, 01/24/2019
Photovoltaic modules - Bypass diode - Thermal runaway teststandard by International Electrotechnical Commission, 08/10/2017
Universal serial bus interfaces for data and power - Part 1-3: Common components - USB Type-C¿¿¿ Cable and Connector Specificationstandard by International
Car multimedia systems and equipment - Drive monitoring system - Part 3: Measurement methodsstandard by International Electrotechnical Commission, 09/13/2019
Electric room heating - Underfloor heating - Performance characteristics - Definitions, method of testing, sizing and formula symbolsstandard by International Electrotechnical Commission,
Medical electrical equipment - Part 2-30: Particular requirements for the basic safety and essential performance of automated non-invasive sphygmomanometersstandard by International Electrotechnical
Book by International Electrotechnical Commission, 01/10/2008