Advances in Thermal Modeling of Electronic Components and Systems: Volume 3

Advances in Thermal Modeling of Electronic Components and Systems: Volume 3

Click here to purchase
This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.

Product Details

Published:
01/01/1993
ISBN(s):
0791800180
Number of Pages:
450
Note:
This product is unavailable in Ukraine, Russia, Belarus

You may also like

ASME BPVC.SSC.VIII.XII.II.V.IX-2023

ASME BPVC.SSC.VIII.XII.II.V.IX-2023

Summary of Significant Changes in the 2023 ASME Boiler and Pressure Vessel Code: Sections VIII, XII, II, V, and IXstandard...

ASME Y14.47-2023

ASME Y14.47-2023

Model Organization Practices: Engineering Product Definition and Related Documentation Practicesstandard by ASME International, 06/06/2023

ASME PTB-15-2023

ASME PTB-15-2023

Full Matrix Capture Training Manualstandard by ASME International, 06/28/2023

ASME BPVC.VIII-2023 SET

ASME BPVC.VIII-2023 SET

2023 ASME Boiler & Pressure Vessel Code - Section VIIi - Materials - COMPLETE 3-Volume set (Sections VIII.1, VIII.2, VIII.3)standard...

Back to Top