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This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow).
Product Details
- Published:
- 04/01/2020
- Number of Pages:
- 38
- File Size:
- 1 file , 1.3 MB
- Redline File Size:
- 2 files , 5.9 MB
