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New IEEE Standard – Active.IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding
Product Details
- Published:
- 03/13/2020
- ISBN(s):
- 9781504465526, 9781504463430, 9781504463447
- Number of Pages:
- 0
- File Size:
- 1 file , 3.8 MB
- Product Code(s):
- STD23997, STDPD23997, STDPL23997
