IEEE 1838-2019

IEEE 1838-2019

Click here to purchase
New IEEE Standard – Active.IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding

Product Details

Published:
03/13/2020
ISBN(s):
9781504465526, 9781504463430, 9781504463447
Number of Pages:
0
File Size:
1 file , 3.8 MB
Product Code(s):
STD23997, STDPD23997, STDPL23997

You may also like

IEEE P1588c

IEEE P1588c

IEEE Draft Standard for a Precision Clock Synchronization Protocol for Networked Measurement and Control Systems Amendment: Clarification of TerminologyAmendment by...

IEEE P3152

IEEE P3152

IEEE Draft Standard for Transparent Agency Identification of Humans and Machinesstandard by IEEE,

IEEE P1800

IEEE P1800

IEEE Draft Standard for SystemVerilog--Unified Hardware Design, Specification, and Verification Languagestandard by IEEE,

IEEE P3304

IEEE P3304

IEEE Draft Standard Adoption of Moving Picture, Audio and Data Coding by Artificial Intelligence (MPAI) Technical Specification Neural Network Watermarking...

Back to Top