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IEC 62108:2016 defines a test sequence that will quickly uncover CPV module failures that have been associated with field exposure to thermal cycling for many years. This document was specifically developed to relate to thermal fatigue failure of the HCPV die-attach, however, it also applies, to some extent, to all thermal fatigue related failure mechanisms for the assemblies submitted to test.
Product Details
- Edition:
- 1.0
- Published:
- 12/14/2016
- Number of Pages:
- 26
- File Size:
- 1 file , 580 KB
