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The purpose of these user guidelines is to provide background and an example for the use of an infrared (IR) microscope to determine die temperature of electronic devices for calculations such as thermal resistance.
GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATIONstandard by JEDEC Solid State Technology Association, 10/01/2007
GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTINGstandard by JEDEC Solid State Technology Association, 11/01/1996
Failure Mechanisms and Models for Semiconductor Devicesstandard by JEDEC Solid State Technology Association, 09/01/2016
METHODS OF MEASUREMENT FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITSstandard by JEDEC Solid State Technology Association, 01/01/1970